3D02200 - SEMI 3D23 - Specification for Glass Carrier Characteristics for Panel Level Packaging (PLP) Applications Revision:SEMI 3D23-0721 - Current NOTICE: This Document was completely

NOTICE: This Document was completely rewritten in 2002

originally published January 2005

24-1116 (first published)

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3D02200 - SEMI 3D23 - Specification for Glass Carrier Characteristics for Panel Level Packaging (PLP) Applications Revision:SEMI 3D23-0721 - Current NOTICE: This Document was completelyThe purpose of this Specification is to establish basic physical dimensions for the glass carrier intended to be used for panel level package processing. This Specification specifies physical dimensions of the glass carrier for use in panel level packaging (PLP) applications.<br><br>This Specification describes glass carrier with 510 mm 515 mm and 600 mm 600 mm panel sizes as specified by the relevant SEMI 3D20. Referenced SEMI Standards (purchase