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Ships within 48 hours · Estimated delivery Aug 21 - Aug 26
the Spirobank II offers quick and precise spirometry results
this chassis supports a wide range of line cards and supervisor modules
Investing in this memory module ensures your infrastructure remains scalable and future-proof
Built-in over voltage and short circuit protection protects networking hardware
HPE C3000 & C7000 Interconnect Filler Module | 414053-001 Processor the Spirobank II offers quickQuick Specs Type: Interconnect bay filler blank Enclosure Compatibility: HPE BladeSystem C3000 and C7000 Purpose: Maintains airflow and thermal balance Installation: Tool less, snap in design Use Case: Blocks empty interconnect bays when no module is present Material: Durable plastic construction Part Number: 414053 001 The HPE C3000 & C7000 Interconnect Filler Module is a precision designed blank used to fill empty interconnect bays in BladeSystem
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