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5 Equipment suppliers should work with their customers to determine which additional GEM capabilities should be implemented for a specific type of equipment
flat panel
The BWS may include one or more bonding layers
1-1104 (technical revision)
E08400 - SEMI E84 - Specification for Enhanced Carrier Handoff Parallel I/O Interface StdTpc-Equipment Process Control 5 Equipment suppliers should workDue to the migration to large wafer sizes, future semiconductor factories will use extensive automated material handling systems (AMHS) to transfer wafer carriers, including FOUPs and open cassettes, of increasing weight. The parallel input output (PI O) control signals between the production equipment and the AMHS must be better defined for more reliable and efficient carrier handoffs (load unload) at production equipment load ports. The purpose of